Interface adhesion analysis and next-generation adhesive bonding technology
A unique book that analyzes and evaluates adhesive interfaces in three-dimensional and complex ways using a new method, summarizing adhesive interface phenomena in spacetime across different scales.
Various attempts to identify factors leading to destruction and degradation are explained. The development of new adhesives applying new analysis techniques for adhesive bonding interfaces and a detailed explanation of next-generation adhesive bonding technologies are also provided!
- Company：エヌ・ティー・エス
- Price：10,000 yen-100,000 yen
